COB (Chip On Board)
COB (Chip On Board)
COB LCM Mounting Technology
Construction Of Wire Bonding
PC Board & Layout
PCB Constrain for COB
|
Parameter |
General |
Advance |
Note |
||
|
Unit |
mm |
mil |
mm |
mil |
|
|
Pitch |
0.394~0.473 |
10~12 |
0.178~0.228 |
7~9 |
|
|
Width |
0.152 |
6 |
0.10~0.127 |
4~5 |
|
|
Spacing |
0.10~0.152 |
4~6 |
0.076~0.102 |
3~4 |
|
|
Thickness |
0.8 |
31.52 |
0.2~0.4 |
7.9~15.9 |
|
Product Line / Products / Process PC Board & Layout
Process
-
PCB cutting
PCB cut into proper size.
-
PCB Cleaning
PCB cleaning
-
Epoxy dripping
Epoxy dripping on PCB Pad
-
Chip On Board
IC Chip on PCB Pad
-
Baking
Baking for IC Chip fixed with Epoxy
-
Wire Bonding
Wire Bonding between Chip & Bonding-pad
-
PCB Dividing
PCB divided into pieces
-
Inspection
COB Function inspection
-
Epoxy Molding
Molding Chip & Wire by Epoxy
-
Baking
Baking for Epoxy package
-
Inspection
Quality inspection of Epoxy molding
